Thermopile module

ABSTRACT

An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

CROSS REFERENCE TO RELATED APPLICATION

This is a continuation application of U.S. application Ser. No.16/144,249, filed on 27 Sep. 2018 and entitled “THERMOPILE MODULE”, U.S.application Ser. No. 14/972,563, filed on 17 Dec. 2015 and entitled“THERMOPILE MODULE”, and U.S. application Ser. No. 14/726,472, filed on30 May 2015 and entitled “WEARABLE DEVICE WITH COMBINED SENSINGCAPABILITIES”, now pending, the entire disclosures of which areincorporated herein by reference.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The instant disclosure relates to a thermopile module; in particular, toa thermopile module which can be used in wearable devices for detectinginfrared temperature.

2. Description of Related Art

A thermopile module in a wearable device is used for detecting infraredtemperature generated from an ambient environment or an object surface(e.g., skin or finger). However, the wearable devices including thethermopile module of prior arts are not waterproof, such that thesekinds of wearable devices of the prior arts are liable to get rusty anddamaged due to moisture.

SUMMARY OF THE INVENTION

In order to overcome the abovementioned problem, this instant disclosureprovides a thermopile module used in a wearable device for measuringinfrared temperature, and the thermopile module has waterproof functionto prevent the wearable device getting rusty due to moisture.

To achieve the abovementioned purpose, one of the embodiments of thisinstant disclosure provides a thermopile module which includes an outercase, a circuit substrate, a sensor chip, a filter structure, and awaterproof structure. The outer case has an opening. The circuitsubstrate is disposed inside the outer case. The sensor chip is disposedon the circuit substrate. The filter structure is disposed above thesensor chip. The waterproof structure is surroundingly connected betweenthe filter structure and the outer case, wherein the waterproofstructure has a through hole for exposing the filter structure andcommunicated with the opening of the outer case.

Another embodiment of this instant disclosure provides a thermopilemodule which includes an outer case, a circuit substrate, a sensor chip,and a waterproof structure. The outer case has an opening. The circuitsubstrate is disposed inside the outer case. The sensor chip is disposedon the circuit substrate. The waterproof structure is disposed on theouter case.

This instant disclosure has the benefit that, the thermopile module ofthis instant disclosure has small size which can be used in a wearabledevice and for measuring infrared temperature generated from an ambientenvironment or an object surface (e.g., skin or finger), and thethermopile module includes a waterproof structure to avoid water gettinginto the thermopile module, so as to prevent the wearable device gettingrusty due to moisture.

In order to further appreciate the characteristics and technicalcontents of the present invention, references are hereunder made to thedetailed descriptions and appended drawings in connection with theinstant disclosure. However, the appended drawings are merely shown forexemplary purposes, rather than being used to restrict the scope of theinstant disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a schematic view of a thermopile module of a firstembodiment in the instant disclosure;

FIG. 2 shows a schematic view of a thermopile module of a secondembodiment in the instant disclosure;

FIG. 3 shows a schematic view of a thermopile module of a thirdembodiment in the instant disclosure;

FIG. 4 shows a schematic view of a thermopile module of a fourthembodiment in the instant disclosure;

FIG. 5 shows a schematic view of a thermopile module of a fifthembodiment in the instant disclosure;

FIG. 6 shows a schematic view of a thermopile module of a sixthembodiment in the instant disclosure;

FIG. 7 shows a schematic view of a thermopile module of a seventhembodiment in the instant disclosure;

FIG. 8 shows a schematic view of a thermopile module of an eighthembodiment in the instant disclosure;

FIG. 9 shows a schematic view of a thermopile module of a ninthembodiment in the instant disclosure;

FIG. 10 shows a schematic view of a thermopile module of a tenthembodiment in the instant disclosure;

FIG. 11 shows a schematic view of a thermopile module of an eleventhembodiment in the instant disclosure;

FIG. 12 shows a schematic view of a thermopile module of a twelfthembodiment in the instant disclosure;

FIG. 13 shows a schematic view of a thermopile module of a thirteenthembodiment in the instant disclosure;

FIG. 14 shows a schematic view of a thermopile module of a fourteenthembodiment in the instant disclosure;

FIG. 15 shows a schematic view of a thermopile module of a fifteenthembodiment in the instant disclosure;

FIG. 16 shows a schematic view of a thermopile module of a sixteenthembodiment in the instant disclosure;

FIG. 17 shows a schematic view of a thermopile module of a seventeenthembodiment in the instant disclosure; and

FIG. 18 shows a schematic view of a thermopile module of an eighteenthembodiment in the instant disclosure.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Embodiments of thermopile module disclosed in the instant disclosure areillustrated via specific examples as follows, and people familiar in theart may easily understand the advantages and efficacies of the instantdisclosure by disclosure of the specification. The instant disclosuremay be implemented or applied by other different specific examples, andeach of the details in the specification may be applied based ondifferent views and may be modified and changed under the existence ofthe spirit of the instant disclosure. The figures in the instantdisclosure are only for brief description, but they are not depictedaccording to actual size and do not reflect the actual size of therelevant structure. The following embodiments further illustrate relatedtechnologies of the instant disclosure in detail, but the scope of theinstant disclosure is not limited herein.

First Embodiment

Please refer to FIG. 1. FIG. 1 shows a schematic view of an electronicdevice T of a first embodiment in the instant disclosure. The electronicdevice T of the first embodiment in the instant disclosure includes anouter case 1, a circuit substrate 2, a thermopile sensor chip 3, afilter structure 4, and a waterproof structure 5. The outer case 1 hasan opening 10. The circuit substrate 2 is disposed inside the outer case1. The thermopile sensor chip 3 is disposed on the circuit substrate 2.The filter structure 4 is disposed above the thermopile sensor chip 3.The waterproof structure 5 is surroundingly connected between the filterstructure 4 and the outer case 1 for sealing up the opening 10 of theouter case 1, wherein the waterproof structure 5 has a through hole 50for exposing the filter structure 4 and communicated with the opening 10of the outer case 1.

The thermopile sensor chip 3 of the electronic device T is electricallyconnected to the circuit substrate 2 by wire-bonding 20 (as shown inFIG. 6) or flip-chip bonding 21 (as shown in FIG. 1).

When skin or finger touches the outer case 1 of the electronic device T,an infrared heat energy generated from the skin or finger passes intothe electronic device T through the opening 10 of the outer case 1, thefilter structure 4 only receives an infrared wave generated from theskin or finger passing through and reflects other waves, the thermopilesensor chip 3 receives the filtered infrared heat, and the infraredtemperature is then obtained. That is to say, when a user touches theouter case 1 of the electronic device, the electronic device will showthe human's body temperature.

Second Embodiment

Please refer to FIG. 2. FIG. 2 shows a schematic view of an electronicdevice T of a second embodiment in the instant disclosure. The structureof the electronic device T of the second embodiment in the instantdisclosure is similar to that of the first embodiment in the instantdisclosure.

The electronic device T of the second embodiment in the instantdisclosure includes an outer case 1, a circuit substrate 2, a thermopilesensor chip 3, a filter structure 4, and a waterproof structure 5. Theouter case 1 has an opening 10. The circuit substrate 2 is disposedinside the outer case 1. The thermopile sensor chip 3 is disposed on thecircuit substrate 2. The filter structure 4 is disposed above thethermopile sensor chip 3. The waterproof structure 5 is surroundinglyconnected between the filter structure 4 and the outer case 1 forsealing up the opening 10 of the outer case 1, wherein the waterproofstructure 5 has a through hole 50 for exposing the filter structure 4and communicated with the opening 10 of the outer case 1.

The difference between the second embodiment and the first embodiment inthis instant disclosure is that, the opening 10 of the outer case 1 andthe through hole 50 of the waterproof structure 5 are filled with aninfrared passing glue 6. The infrared passing glue 6 is made from atransparent material, when the infrared passing glue 6 is solidified,the infrared passing glue 6 is integrated with the electronic device T,and the infrared passing glue 6 can let an infrared heat energygenerated from an ambient environment or an object surface (e.g., skinor finger) passes therethrough. In addition, since the infrared passingglue 6 is integrated with the electronic device T, which can preventwater and dust getting into the electronic device T.

Specifically, when skin or finger touches the infrared passing glue 6 ofthe outer case 1 of the electronic device T, the infrared heat energygenerated from the skin or finger passes into the electronic device Tthrough the infrared passing glue 6, the filter structure 4 onlyreceives the infrared wave generated from the skin or finger passingthrough and reflects other waves, the thermopile sensor chip 3 receivesthe filtered infrared heat, and the infrared temperature is thenobtained.

Third Embodiment

Please refer to FIG. 3. FIG. 3 shows a schematic view of a thermopilemodule of a third embodiment in the instant disclosure. The structure ofthe electronic device T of the third embodiment in the instantdisclosure is similar to that of the first embodiment in the instantdisclosure.

The electronic device T of the third embodiment in the instantdisclosure includes an outer case 1, a circuit substrate 2, a thermopilesensor chip 3, a filter structure 4, and a waterproof structure 5. Theouter case 1 has an opening 10. The circuit substrate 2 is disposedinside the outer case 1. The thermopile sensor chip 3 is disposed on thecircuit substrate 2. The filter structure 4 is disposed above thethermopile sensor chip 3. The waterproof structure 5 is surroundinglyconnected between the filter structure 4 and the outer case 1 forsealing up the opening 10 of the outer case 1, wherein the waterproofstructure 5 has a through hole 50 for exposing the filter structure 4and communicated with the opening 10 of the outer case 1.

The difference between the third embodiment and the first embodiment inthis instant disclosure is that, the filter structure 4 has a filtercovering portion 40 and a filter supporting portion 41, the filtercovering portion 40 is disposed above the thermopile sensor chip 3 andconnected to the waterproof structure 5, and the filter supportingportion 41 is extended downwardly from the filter covering portion 40 tocontact the circuit substrate 2 for supporting the filter coveringportion 40.

Specifically, when skin or finger touches the outer case 1 of theelectronic device T, an infrared heat energy generated from the skin orfinger passes into the electronic device T through the opening 10 of theouter case 1, the filter structure 4 only receives an infrared wavegenerated from the skin or finger passing through and reflects otherwaves, the thermopile sensor chip 3 receives the filtered infrared heat,and the infrared temperature is then obtained.

Fourth Embodiment

Please refer to FIG. 4. FIG. 4 shows a schematic view of an electronicdevice T of a fourth embodiment in the instant disclosure. The structureof the electronic device T of the fourth embodiment in the instantdisclosure is similar to that of the first embodiment in the instantdisclosure.

The electronic device T of the fourth embodiment in the instantdisclosure includes an outer case 1, a circuit substrate 2, a thermopilesensor chip 3, a filter structure 4, and a waterproof structure 5. Theouter case 1 has an opening 10. The circuit substrate 2 is disposedinside the outer case 1. The thermopile sensor chip 3 is disposed on thecircuit substrate 2. The filter structure 4 is disposed above thethermopile sensor chip 3. The waterproof structure 5 is surroundinglyconnected between the filter structure 4 and the outer case 1 forsealing up the opening 10 of the outer case 1, wherein the waterproofstructure 5 has a through hole 50 for exposing the filter structure 4and communicated with the opening 10 of the outer case 1.

The difference between the fourth embodiment and the first embodiment inthis instant disclosure is that, the electronic device T furtherincludes a support structure 7 disposed between the circuit substrate 2and the waterproof structure 5 for supporting the waterproof structure5.

Specifically, when skin or finger touches the outer case 1 of theelectronic device T, an infrared heat energy generated from the skin orfinger passes into the electronic device T through the opening 10 of theouter case 1, the filter structure 4 only receives an infrared wavegenerated from the skin or finger passing through and reflects otherwaves, the thermopile sensor chip 3 receives the filtered infrared heat,and the infrared temperature is then obtained.

Fifth Embodiment

Please refer to FIG. 5. FIG. 5 shows a schematic view of an electronicdevice T of a fifth embodiment in the instant disclosure. The structureof the electronic device T of the fifth embodiment in the instantdisclosure is similar to that of the fourth embodiment in the instantdisclosure.

The electronic device T of the fifth embodiment in the instantdisclosure includes an outer case 1, a circuit substrate 2, a thermopilesensor chip 3, a filter structure 4, a waterproof structure 5, and asupport structure 7. The outer case 1 has an opening 10. The circuitsubstrate 2 is disposed inside the outer case 1. The thermopile sensorchip 3 is disposed on the circuit substrate 2. The filter structure 4 isdisposed above the thermopile sensor chip 3. The waterproof structure 5is surroundingly connected between the filter structure 4 and the outercase 1 for sealing up the opening 10 of the outer case 1, wherein thewaterproof structure 5 has a through hole 50 for exposing the filterstructure 4 and communicated with the opening 10 of the outer case 1.The support structure 7 is disposed between the circuit substrate 2 andthe waterproof structure 5 for supporting the waterproof structure 5.

The difference between the fifth embodiment and the fourth embodiment inthis instant disclosure is that, the opening 10 of the outer case 1 andthe through hole 50 of the waterproof structure 5 are filled with aninfrared passing glue 6. The infrared passing glue 6 is made from atransparent material, when the infrared passing glue 6 is solidified,the infrared passing glue 6 is integrated with the electronic device T,and the infrared passing glue 6 can let an infrared heat energygenerated from an ambient environment or an object surface (e.g., skinor finger) passes therethrough. In addition, since the infrared passingglue 6 is integrated with the electronic device T, which can preventwater and dust getting into the electronic device T.

Specifically, when skin or finger touches the infrared passing glue 6 ofthe outer case 1 of the electronic device T, the infrared heat energygenerated from the skin or finger passes into the electronic device Tthrough the infrared passing glue 6, the filter structure 4 onlyreceives the infrared wave generated from the skin or finger passingthrough and reflects other waves, the thermopile sensor chip 3 receivesthe filtered infrared heat, and the infrared temperature is thenobtained.

Sixth Embodiment

Please refer to FIG. 6. FIG. 6 shows a schematic view of an electronicdevice T of a sixth embodiment in the instant disclosure. The structureof the electronic device T of the sixth embodiment in the instantdisclosure is similar to that of the fourth embodiment in the instantdisclosure.

The electronic device T of the sixth embodiment in the instantdisclosure includes an outer case 1, a circuit substrate 2, a thermopilesensor chip 3, a filter structure 4, a waterproof structure 5, and asupport structure 7. The outer case 1 has an opening 10. The circuitsubstrate 2 is disposed inside the outer case 1. The thermopile sensorchip 3 is disposed on the circuit substrate 2. The filter structure 4 isdisposed above the thermopile sensor chip 3. The waterproof structure 5is surroundingly connected between the filter structure 4 and the outercase 1 for sealing up the opening 10 of the outer case 1.

The difference between the sixth embodiment and the fourth embodiment inthis instant disclosure is that, the waterproof structure 5 is disposedon the circuit substrate 2 for encapsulating the thermopile sensor chip3 and the filter structure 4, and the support structure 7 is disposedbetween the circuit substrate 2 and the outer case 1 for supporting theouter case 1. Since the thermopile sensor chip 3 and the filterstructure 4 are completely covered by the waterproof structure 5, whichcan prevent the moisture or particles getting into the electronic deviceT. In addition, the material of waterproof structure 5 is transparent,such that the infrared can pass therethrough. Since the waterproofstructure 5 is encapsulated filled in the electronic device T, it canprevent water and dust getting into the electronic device T.

Specifically, when skin or finger touches the outer case 1 of theelectronic device T, an infrared heat energy generated from the skin orfinger passes into the electronic device T through the opening 10 of theouter case 1, the filter structure 4 only receives an infrared wavegenerated from the skin or finger passing through and reflects otherwaves, the thermopile sensor chip 3 receives the filtered infrared heat,and the infrared temperature is then obtained.

Seventh Embodiment

Please refer to FIG. 7. FIG. 7 shows a schematic view of an electronicdevice T of a seventh embodiment in the instant disclosure. Thestructure of the electronic device T of the seventh embodiment in theinstant disclosure is similar to that of the first embodiment in theinstant disclosure.

The electronic device T of the seventh embodiment in the instantdisclosure includes an outer case 1, a circuit substrate 2, a thermopilesensor chip 3, a filter structure 4, and a waterproof structure 5. Theouter case 1 has an opening 10. The circuit substrate 2 is disposedinside the outer case 1. The thermopile sensor chip 3 is disposed on thecircuit substrate 2. The filter structure 4 is disposed above thethermopile sensor chip 3. The waterproof structure 5 is disposed on thecircuit substrate 2 for encapsulating the thermopile sensor chip 3 andthe filter structure 4. Since the thermopile sensor chip 3 and thefilter structure 4 are covered by the waterproof structure 5, which canprevent the moisture or particles getting into the electronic device T.

The difference between the seventh embodiment and the first embodimentin this instant disclosure is that, the waterproof structure 5 includesa first waterproofing element 51, a second waterproofing element 52, anda support structure 53, the first waterproofing element 51 issurroundingly connected onto the filter structure 4, the secondwaterproofing element 52 is surroundingly connected onto the outer case1, the support structure 53 is disposed between the first waterproofingelement 51 and the second waterproofing element 52, and the supportstructure 53 has a first support portion 530 connected between the firstwaterproofing element 51 and the second waterproofing element 52 and asecond support portion 531 extended downwardly from the first supportportion 530 to contact the circuit substrate 2 for supporting the secondwaterproofing element 52. Furthermore, the first waterproofing element51 has a first through hole 510, the second waterproofing element 52 hasa second through hole 520 communicated with the opening 10 of the outercase 1, and the first support portion 530 has a third through hole 530 acommunicated between the first through hole 510 and the second throughhole 520.

When skin or finger touches the outer case 1 of the electronic device T,an infrared heat energy generated from the skin or finger passes intothe electronic device T through the opening 10 of the outer case 1, thefilter structure 4 only receives an infrared wave generated from theskin or finger passing through and reflects other waves, the thermopilesensor chip 3 receives the filtered infrared heat, and the infraredtemperature is then obtained.

Eighth Embodiment

Please refer to FIG. 8. FIG. 8 shows a schematic view of an electronicdevice T of an eighth embodiment in the instant disclosure. Thestructure of the electronic device T of the eighth embodiment in theinstant disclosure is similar to that of the seventh embodiment in theinstant disclosure.

The electronic device T of the eighth embodiment in the instantdisclosure includes an outer case 1, a circuit substrate 2, a thermopilesensor chip 3, a filter structure 4, and a waterproof structure 5. Theouter case 1 has an opening 10. The circuit substrate 2 is disposedinside the outer case 1. The thermopile sensor chip 3 is disposed on thecircuit substrate 2. The filter structure 4 is disposed above thethermopile sensor chip 3. The waterproof structure 5 is disposed on thecircuit substrate 2 for encapsulating the thermopile sensor chip 3 andthe filter structure 4, wherein the waterproof structure 5 includes afirst waterproofing element 51, a second waterproofing element 52, and asupport structure 53. The first waterproofing element 51 issurroundingly connected onto the filter structure 4, the secondwaterproofing element 52 is surroundingly connected onto the outer case1, and the support structure 53 is disposed between the firstwaterproofing element 51 and the second waterproofing element 52,wherein the support structure 53 has a first support portion 530connected between the first waterproofing element 51 and the secondwaterproofing element 52 and a second support portion 531 extendeddownwardly from the first support portion 530 to contact the circuitsubstrate 2 for supporting the second waterproofing element. The firstwaterproofing element 51 has a first through hole 510, the secondwaterproofing element 52 has a second through hole 520 communicated withthe opening 10 of the outer case 1, and the first support portion 530has a third through hole 530 a communicated between the first throughhole 510 and the second through hole 520. Since the thermopile sensorchip 3 and the filter structure 4 are completely covered by thewaterproof structure 5, which can prevent the moisture or particlesgetting into the electronic device T.

The difference between the eighth embodiment and the seventh embodimentin this instant disclosure is that, the opening 10 of the outer case 1and the first, the second, and the third through holes 510, 520, 530 aof the waterproof structure 5 are filled with an infrared passing glue6. The infrared passing glue 6 is made from a transparent material, whenthe infrared passing glue 6 is solidified, the infrared passing glue 6is integrated with the electronic device T, and the infrared passingglue 6 can let an infrared heat energy generated from an ambientenvironment or an object surface (e.g., skin or finger) passestherethrough. In addition, since the infrared passing glue 6 isintegrated with the electronic device T, which can prevent water anddust getting into the electronic device T.

Specifically, when skin or finger touches the infrared passing glue 6 ofthe outer case 1 of the electronic device T, the infrared heat energygenerated from the skin or finger passes into the electronic device Tthrough the infrared passing glue 6, the filter structure 4 onlyreceives the infrared wave generated from the skin or finger passingthrough and reflects other waves, the thermopile sensor chip 3 receivesthe filtered infrared heat, and the infrared temperature is thenobtained.

Ninth Embodiment

Please refer to FIG. 9. FIG. 9 shows a schematic view of an electronicdevice T of a ninth embodiment in the instant disclosure. The structureof the electronic device T of the ninth embodiment in the instantdisclosure is similar to that of the third embodiment in the instantdisclosure.

The electronic device T of the ninth embodiment in the instantdisclosure includes an outer case 1, a circuit substrate 2, a thermopilesensor chip 3, a filter structure 4, and a waterproof structure 5. Theouter case 1 has an opening 10. The circuit substrate 2 is disposedinside the outer case 1. The thermopile sensor chip 3 is disposed on thecircuit substrate 2. The filter structure 4 is disposed above thethermopile sensor chip 3. The filter structure 4 has a filter coveringportion 40 and a filter supporting portion 41, the filter coveringportion 40 is disposed above the thermopile sensor chip 3 and connectedto the waterproof structure 5, and the filter supporting portion 41 isextended downwardly from the filter covering portion 40 to contact thecircuit substrate 2 for supporting the filter covering portion 40. Thewaterproof structure 5 is surroundingly connected between the filterstructure 4 and the outer case 1 for sealing up the opening 10 of theouter case 1, wherein the waterproof structure 5 has a through hole 50for exposing the filter structure 4 and communicated with the opening 10of the outer case 1.

The difference between the ninth embodiment and the third embodiment inthis instant disclosure is that, the filter covering portion 40 issuspend above the thermopile sensor chip 3.

Specifically, when skin or finger touches the outer case 1 of theelectronic device T, an infrared heat energy generated from the skin orfinger passes into the electronic device T through the opening 10 of theouter case 1, the filter structure 4 only receives an infrared wavegenerated from the skin or finger passing through and reflects otherwaves, the thermopile sensor chip 3 receives the filtered infrared heat,and the infrared temperature is then obtained.

Tenth Embodiment

Please refer to FIG. 10. FIG. 10 shows a schematic view of an electronicdevice T of a tenth embodiment in the instant disclosure. The structureof the electronic device T of the tenth embodiment in the instantdisclosure is similar to that of the ninth embodiment in the instantdisclosure.

The electronic device T of the tenth embodiment in the instantdisclosure includes an outer case 1, a circuit substrate 2, a thermopilesensor chip 3, a filter structure 4, and a waterproof structure 5. Theouter case 1 has an opening 10. The circuit substrate 2 is disposedinside the outer case 1. The thermopile sensor chip 3 is disposed on thecircuit substrate 2. The filter structure 4 is disposed above thethermopile sensor chip 3. The filter structure 4 has a filter coveringportion 40 and a filter supporting portion 41, the filter coveringportion 40 is suspend above the thermopile sensor chip 3 and connectedto the waterproof structure 5, and the filter supporting portion 41 isextended downwardly from the filter covering portion 40 to contact thecircuit substrate 2 for supporting the filter covering portion 40. Thewaterproof structure 5 is surroundingly connected between the filterstructure 4 and the outer case 1 for sealing up the opening 10 of theouter case 1, wherein the waterproof structure 5 has a through hole 50for exposing the filter structure 4 and communicated with the opening 10of the outer case 1.

The difference between the tenth embodiment and the ninth embodiment inthis instant disclosure is that, the opening 10 of the outer case 1 andthe through hole 50 of the waterproof structure 5 are filled with aninfrared passing glue 6. The infrared passing glue 6 is made from atransparent material, when the infrared passing glue 6 is solidified,the infrared passing glue 6 is integrated with the electronic device T,and the infrared passing glue 6 can let an infrared heat energygenerated from an ambient environment or an object surface (e.g., skinor finger) passes therethrough. In addition, since the infrared passingglue 6 is integrated with the electronic device T, which can preventwater and dust getting into the electronic device T.

Specifically, when skin or finger touches the infrared passing glue 6 ofthe outer case 1 of the electronic device T, the infrared heat energygenerated from the skin or finger passes into the electronic device Tthrough the infrared passing glue 6, the filter structure 4 onlyreceives the infrared wave generated from the skin or finger passingthrough and reflects other waves, the thermopile sensor chip 3 receivesthe filtered infrared heat, and the infrared temperature is thenobtained.

Eleventh Embodiment

Please refer to FIG. 11. FIG. 11 shows a schematic view of an electronicdevice T of an eleventh embodiment in the instant disclosure. Anelectronic device T of the eleventh embodiment in the instant disclosureincludes an outer case 1, a circuit substrate 2, a thermopile sensorchip 3, and a waterproof structure 5. The outer case 1 has an opening10. The circuit substrate 2 is disposed inside the outer case 1. Thethermopile sensor chip 3 is disposed on the circuit substrate 2, and iselectrically connected to the circuit substrate 2 by wire-bonding 20.The waterproof structure 5 is disposed on the outer case 1 for sealingup the opening 10 of the outer case 1, and the waterproof structure 5 isa filter structure 4 which is disposed above the thermopile sensor chip3 and can only let the infrared wave passing therethrough.

Specifically, when skin or finger touches the waterproof structure 5 ofthe electronic device T, an infrared heat energy generated from the skinor finger passes into the electronic device T through the waterproofstructure 5, since the waterproof structure 5 is a filter structure 4which is disposed above the thermopile sensor chip 3 and only receivesthe infrared wave generated from the skin or finger passing through andreflects other waves, the thermopile sensor chip 3 receives the filteredinfrared heat, and the infrared temperature is then obtained.

Twelfth Embodiment

Please refer to FIG. 12. FIG. 12 shows a schematic view of an electronicdevice T of a twelfth embodiment in the instant disclosure. Thestructure of the electronic device T of the twelfth embodiment in theinstant disclosure is similar to that of the eleventh embodiment in theinstant disclosure.

The electronic device T of the twelfth embodiment in the instantdisclosure includes an outer case 1, a circuit substrate 2, a thermopilesensor chip 3, and a waterproof structure 5. The outer case 1 has anopening 10. The circuit substrate 2 is disposed inside the outer case 1.The thermopile sensor chip 3 is disposed on the circuit substrate 2. Thewaterproof structure 5 is disposed on the outer case 1 for sealing upthe opening 10 of the outer case 1, and the waterproof structure 5 is afilter structure 4 which is disposed above the thermopile sensor chip 3and can only let the infrared wave passing therethrough.

The difference between the twelfth embodiment and the eleventhembodiment in this instant disclosure is that, the thermopile sensorchip 3 is electrically connected to the circuit substrate 2 by flip-chipbonding 21.

Specifically, when skin or finger touches the waterproof structure 5 ofthe electronic device T, an infrared heat energy generated from the skinor finger passes into the electronic device T through the waterproofstructure 5, since the waterproof structure 5 is a filter structure 4which is disposed above the thermopile sensor chip 3 and only receivesthe infrared wave generated from the skin or finger passing through andreflects other waves, the thermopile sensor chip 3 receives the filteredinfrared heat, and the infrared temperature is then obtained.

Thirteenth Embodiment

Please refer to FIG. 13. FIG. 13 shows a schematic view of an electronicdevice T of a thirteenth embodiment in the instant disclosure. Thestructure of the electronic device T of the thirteenth embodiment in theinstant disclosure is similar to that of the eleventh embodiment in theinstant disclosure.

The electronic device T of the thirteenth embodiment in the instantdisclosure includes an outer case 1, a circuit substrate 2, a thermopilesensor chip 3, and a waterproof structure 5. The outer case 1 has anopening 10. The circuit substrate 2 is disposed inside the outer case 1.The thermopile sensor chip 3 is disposed on the circuit substrate 2, andis electrically connected to the circuit substrate 2 by wire-bonding 20.The waterproof structure 5 is disposed on the outer case 1 for sealingup the opening 10 of the outer case 1, and the waterproof structure 5 isa filter structure 4 which is disposed above the thermopile sensor chip3 and can only let the infrared wave passing therethrough.

The difference between the thirteenth embodiment and the eleventhembodiment in this instant disclosure is that, the electronic device Tfurther includes an isolation structure 8 surroundingly connected on thewaterproof structure 5 and having an aperture 80 for exposing thewaterproof structure 5.

Specifically, when skin or finger touches isolation structure 8 of theelectronic device T, an infrared heat energy generated from the skin orfinger passes into the electronic device T through the aperture 80,since the waterproof structure 5 is a filter structure 4 which isdisposed above the thermopile sensor chip 3 and only receives theinfrared wave generated from the skin or finger passing through andreflects other waves, the thermopile sensor chip 3 receives the filteredinfrared heat, and the infrared temperature is then obtained.

Fourteenth Embodiment

Please refer to FIG. 14. FIG. 14 shows a schematic view of an electronicdevice T of a fourteenth embodiment in the instant disclosure. Thestructure of the electronic device T of the fourteenth embodiment in theinstant disclosure is similar to that of the twelfth embodiment in theinstant disclosure.

The electronic device T of the fourteenth embodiment in the instantdisclosure includes an outer case 1, a circuit substrate 2, a thermopilesensor chip 3, and a waterproof structure 5. The outer case 1 has anopening 10. The circuit substrate 2 is disposed inside the outer case 1.The thermopile sensor chip 3 is disposed on the circuit substrate 2, andis electrically connected to the circuit substrate 2 by flip-chipbonding 21. The waterproof structure 5 is disposed on the outer case 1for sealing up the opening 10 of the outer case 1.

The difference between the fourteenth embodiment and the twelfthembodiment in this instant disclosure is that, the electronic device Tfurther includes a filter structure 4 disposed on the thermopile sensorchip 3, and the waterproof structure 5 is an infrared pass structurewhich is disposed above the filter structure 4 and is made from atransparent material.

Specifically, when skin or finger touches the waterproof structure 5 ofelectronic device T, the infrared heat energy generated from the skin orfinger passes into the electronic device T through the waterproofstructure 5, since the waterproof structure 5 is an infrared passstructure which can let the infrared heat energy passing therethrough,the filter structure 4 only receives the infrared wave obtained from thewaterproof structure 5 and reflects other waves, the thermopile sensorchip 3 receives the filtered infrared heat, and the infrared temperatureis then obtained.

Fifteenth Embodiment

Please refer to FIG. 15. FIG. 15 shows a schematic view of an electronicdevice T of a fifteenth embodiment in the instant disclosure. Thestructure of the electronic device T of the fifteenth embodiment in theinstant disclosure is similar to that of the fourteenth embodiment inthe instant disclosure.

The electronic device T of the fifteenth embodiment in the instantdisclosure includes an outer case 1, a circuit substrate 2, a thermopilesensor chip 3, a filter structure 4, and a waterproof structure 5. Theouter case 1 has an opening 10. The circuit substrate 2 is disposedinside the outer case 1. The thermopile sensor chip 3 is disposed on thecircuit substrate 2, and is electrically connected to the circuitsubstrate 2 by flip-chip bonding 21. The filter structure 4 is disposedon the thermopile sensor chip 3. The waterproof structure 5 is disposedon the outer case 1 for sealing up the opening 10 of the outer case 1,and the waterproof structure 5 is an infrared pass structure which isdisposed above the filter structure 4 and is made from a transparentmaterial.

The difference between the fifteenth embodiment and the fourteenthembodiment in this instant disclosure is that, the waterproof structure5 includes a first waterproofing element 51 which is an waterproofingglue and a second waterproofing element 52 which is an infrared passstructure, the first waterproofing element 51 is surroundingly connectedon the outer case 1 and has a first through hole 510 communicated withthe opening 10 of the outer case 1, and the second waterproofing element52 is disposed on the first waterproofing element 51 for sealing up theopening of the outer case.

Specifically, when skin or finger touches the waterproof structure 5 ofelectronic device T, the infrared heat energy generated from the skin orfinger passes into the electronic device T through the waterproofstructure 5, since the waterproof structure 5 is an infrared passstructure which can let the infrared heat energy passing therethrough,the filter structure 4 only receives the infrared wave obtained from thewaterproof structure 5 and reflects other waves, the thermopile sensorchip 3 receives the filtered infrared heat, and the infrared temperatureis then obtained.

Sixteenth Embodiment

Please refer to FIG. 16. FIG. 16 shows a schematic view of an electronicdevice T of a sixteenth embodiment in the instant disclosure. Thestructure of the electronic device T of the sixteenth embodiment in theinstant disclosure is similar to that of the fourteenth embodiment inthe instant disclosure.

The electronic device T of the sixteenth embodiment in the instantdisclosure includes an outer case 1, a circuit substrate 2, a thermopilesensor chip 3, a filter structure 4, and a waterproof structure 5. Theouter case 1 has an opening 10. The circuit substrate 2 is disposedinside the outer case 1. The thermopile sensor chip 3 is disposed on thecircuit substrate 2. The filter structure 4 is disposed on thethermopile sensor chip 3. The waterproof structure 5 is disposed on theouter case 1 for sealing up the opening 10 of the outer case 1, and thewaterproof structure 5 is an infrared pass structure which is disposedabove the filter structure 4 and is made from a transparent materialwhich can let an infrared passing therethrough.

The difference between the sixteenth embodiment and the eleventhembodiment in this instant disclosure is that, the outer case 1 iscovered with the waterproof structure 5 which is an infrared passstructure. The thermopile sensor chip 3 is electrically connected to thecircuit substrate 2 by wire-bonding 20.

Specifically, when skin or finger touches the waterproof structure 5 ofelectronic device T, the infrared heat energy generated from the skin orfinger passes into the electronic device T through the waterproofstructure 5, since the waterproof structure 5 is an infrared passstructure which can let the infrared heat energy passing therethrough,the filter structure 4 only receives the infrared wave obtained from thewaterproof structure 5 and reflects other waves, the thermopile sensorchip 3 receives the filtered infrared heat, and the infrared temperatureis then obtained.

Seventeenth Embodiment

Please refer to FIG. 17. FIG. 17 shows a schematic view of an electronicdevice T of a seventeenth embodiment in the instant disclosure. Thestructure of the electronic device T of the seventeenth embodiment inthe instant disclosure is similar to that of the sixteenth embodiment inthe instant disclosure.

The electronic device T of the seventeenth embodiment in the instantdisclosure includes an outer case 1, a circuit substrate 2, a thermopilesensor chip 3, a filter structure 4, and a waterproof structure 5. Theouter case 1 has an opening 10. The circuit substrate 2 is disposedinside the outer case 1. The thermopile sensor chip 3 is disposed on thecircuit substrate 2, and is electrically connected to the circuitsubstrate 2 by wire-bonding 20. The filter structure 4 is disposed onthe thermopile sensor chip 3. The waterproof structure 5 is disposed onthe outer case 1 for sealing up the opening 10 of the outer case 1, andthe waterproof structure 5 is an infrared pass structure which isdisposed above the filter structure 4 and is made from a transparentmaterial which can let an infrared passing therethrough. The outer case1 is covered with the waterproof structure 5 which is an infrared passstructure.

The difference between the seventeenth embodiment and the sixteenthembodiment in this instant disclosure is that, the electronic device Tfurther includes a dust preventing structure 9, wherein the dustpreventing structure 9 is disposed on the circuit substrate 2 forencapsulating the thermopile sensor chip 3 and the filter structure 4.Since the thermopile sensor chip 3 and the filter structure 4 arecompletely covered by the waterproof structure 5 and the dust preventingstructure 9, which can prevent the moisture or particles getting intothe electronic device T. In addition, the material of the dustpreventing structure 9 is transparent, such that the infrared can passtherethrough.

Specifically, when skin or finger touches the waterproof structure 5 ofelectronic device T, the infrared heat energy generated from the skin orfinger passes into the electronic device T through the waterproofstructure 5, since the waterproof structure 5 is an infrared passstructure, and both of the material of the infrared pass structure andthe dust preventing structure 9 are transparent, such that the infraredheat energy can pass therethrough. The filter structure 4 only receivesthe infrared wave obtained from the waterproof structure 5 and the dustpreventing structure 9, and reflects other waves. The thermopile sensorchip 3 receives the filtered infrared heat, and the infrared temperatureis then obtained.

Eighteenth Embodiment

Please refer to FIG. 18. FIG. 18 shows a schematic view of an electronicdevice T of an eighteenth embodiment in the instant disclosure. Thestructure of the electronic device T of the eighteenth embodiment in theinstant disclosure is similar to that of the seventeenth embodiment inthe instant disclosure.

The electronic device T of the eighteenth embodiment in the instantdisclosure includes an outer case 1, a circuit substrate 2, a thermopilesensor chip 3, a filter structure 4, a waterproof structure 5, and adust preventing structure 9. The outer case 1 has an opening 10. Thecircuit substrate 2 is disposed inside the outer case 1. The thermopilesensor chip 3 is disposed on the circuit substrate 2, and iselectrically connected to the circuit substrate 2 by wire-bonding 20.The filter structure 4 is disposed on the thermopile sensor chip 3. Thewaterproof structure 5 is disposed on the outer case 1 for sealing upthe opening 10 of the outer case 1, and the waterproof structure 5 is aninfrared pass structure which is disposed above the filter structure 4and is made from a transparent material which can let an infraredpassing therethrough. The outer case 1 is covered with the waterproofstructure 5 which is an infrared pass structure. The dust preventingstructure 9 is disposed on the circuit substrate 2 for encapsulating thethermopile sensor chip 3 and the filter structure 4. Since thethermopile sensor chip 3 and the filter structure 4 are completelycovered by the waterproof structure 5 and the dust preventing structure9, which can prevent the moisture or particles getting into theelectronic device T. In addition, the material of the dust preventingstructure 9 is transparent, such that the infrared can passtherethrough.

The difference between the eighteenth embodiment and the seventeenthembodiment in this instant disclosure is that, the waterproof structure5 has a through hole 50 passing through the opening 10 of the outer case1 for exposing the dust preventing structure 9.

Specifically, when skin or finger touches the waterproof structure 5 ofelectronic device T, the infrared heat energy generated from the skin orfinger passes into the electronic device T through the through hole 50,since the material of the dust preventing structure 9 is transparent,the infrared heat energy can pass therethrough. The filter structure 4only receives the infrared wave obtained from the waterproof structure 5and the dust preventing structure 9, and reflects other waves. Thethermopile sensor chip 3 receives the filtered infrared heat, and theinfrared temperature is then obtained.

In summary, the benefit of the instant disclosure is that, thethermopile module of this instant disclosure includes a waterproofstructure, and has small size which can be used in a wearable device formeasuring infrared temperature generated from an ambient environment oran object surface (e.g., skin or finger). Since the thermopile module ofthis instant disclosure including the waterproof structure, it can avoidwater getting into the thermopile module, so as to prevent the wearabledevice getting rusty due to moisture. In addition, infrared passing glueand the dust preventing structure can avoid the dust particles gettinginto the thermopile module, so as to prevent the wearable device beingdamaged due to dust particles.

The descriptions illustrated supra set forth simply the preferredembodiments of the present invention; however, the characteristics ofthe present invention are by no means restricted thereto. All changes,alterations, or modifications conveniently considered by those skilledin the art are deemed to be encompassed within the scope of the presentinvention delineated by the following claims.

What is claimed is:
 1. An electronic device, comprising: an outer casehaving an opening; a circuit substrate disposed inside the outer case; athermopile sensor chip disposed on the circuit substrate; a filterstructure disposed above the thermopile sensor chip; and a waterproofstructure surroundingly connected between the filter structure and theouter case.
 2. The electronic device as claimed in claim 1, wherein thethermopile sensor chip is electrically connected to the circuitsubstrate by wire-bonding or flip-chip bonding.
 3. The electronic deviceas claimed in claim 1, wherein the waterproof structure has a throughhole for exposing the filter structure and communicated with the openingof the outer case.
 4. The electronic device as claimed in claim 3,wherein the opening of the outer case and the through hole of thewaterproof structure are filled with an infrared passing glue.
 5. Theelectronic device as claimed in claim 3, wherein the filter structurehas a filter covering portion and a filter supporting portion, thefilter covering portion is suspended above the thermopile sensor chipand connected to the waterproof structure, and the filter supportingportion is extended downwardly from the filter covering portion tocontact the circuit substrate for supporting the filter coveringportion.
 6. The electronic device as claimed in claim 3, furthercomprising a support structure disposed between the circuit substrateand the waterproof structure for supporting the waterproof structure. 7.The electronic device as claimed in claim 6, wherein the opening of theouter case and the through hole of the waterproof structure are filledwith an infrared passing glue.
 8. The electronic device as claimed inclaim 1, wherein the waterproof structure disposed on the circuitsubstrate for encapsulating the thermopile sensor chip and the filterstructure.
 9. The electronic device as claimed in claim 1, wherein thewaterproof structure includes a first waterproofing element, a secondwaterproofing element, and a support structure, the first waterproofingelement is surroundingly connected onto the filter structure, the secondwaterproofing element is surroundingly connected onto the outer case,the support structure is disposed between the first waterproofingelement and the second waterproofing element, and the support structurehas a first support portion connected between the first waterproofingelement and the second waterproofing element and a second supportportion extended downwardly from the first support portion to contactthe circuit substrate for supporting the second waterproofing element.10. The electronic device as claimed in claim 3, wherein the filterstructure has a filter covering portion and a filter supporting portion,the filter covering portion is suspend above the thermopile sensor chipand connected to the waterproof structure, and the filter supportingportion is extended downwardly from the filter covering portion tocontact the circuit substrate for supporting the filter coveringportion.
 11. The electronic device as claimed in claim 3, wherein theopening of the outer case and the through hole of the waterproofstructure are filled with an infrared passing glue.
 12. An electronicdevice, comprising: an outer case having an opening; a circuit substratedisposed inside the outer case; a thermopile sensor chip disposed on thecircuit substrate; and a waterproof structure disposed on the outercase.
 13. The electronic device as claimed in claim 12, wherein thethermopile sensor chip is electrically connected to the circuitsubstrate by wire-bonding or flip-chip bonding.
 14. The electronicdevice as claimed in claim 13, wherein the waterproof structure is afilter structure disposed above the thermopile sensor chip.
 15. Theelectronic device as claimed in claim 12, further comprising anisolation structure surroundingly connected onto the filter structure,and the isolation structure having an aperture for exposing the filterstructure.
 16. The electronic device as claimed in claim 13, furthercomprising a filter structure disposed on the thermopile sensor chip.17. The electronic device as claimed in claim 12, wherein the waterproofstructure is an infrared pass structure disposed above the filterstructure.